Plasma etch and deposition systems for the compound semiconductor market, reliably producing high-performance devices for both labs and volume device manufacturing.
Our range of plasma processing systems provides a complete solution to Atomic Scale Processing. We provide unique cluster capability or stand alone systems enabling the manipulation of matter with atomic scale precision on a production scale.
Ion beam etching (IBE) offers maximum flexibility coupled with excellent uniformity and is suitable for a wide range of applications.
The PECVD process modules are specifically designed to produce excellent uniformity and high rate films, with control of film properties such as refractive index, stress, electrical characteristics and wet chemical etch rate.
Plasma etching is an essential tool in today’s world, enabling many of the technologies we take for granted. Types of plasma etching include Inductively Coupled Plasma, Reaction Ion and Plasma Enhanced Etching.
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