14 March 2017
And the High Volume Manufacturing Award goes to... Oxford Instruments Plasma Technology!
Oxford Instruments Plasma Technology received the High Volume Manufacturing Award at the annual CS Industry Awards on 7 March 2017 in Brussels.
The award highlights the company’s development of SiC plasma etch processes, delivered through the company’s own PlasmaPro100 Polaris system.
“We are very excited to receive this award as it recognises some of the great innovation that is carried out by the people here at Plasma Technology. The SiC via etch process developed is an important step in producing next generation Radio Frequency devices, it gives excellent device performance with the smooth etch sidewalls and low cost of ownership.”, comments Frazer Anderson, Strategic Marketing & Business Development Director, at Oxford Instruments Plasma Technology.
The awards, now in their fifth year, recognise success and development along the entire value chain of the Compound Semiconductor industry from research to completed devices, with a focus on the people, processes and products that drive the industry forward. The awards were presented at the CS International Conference which was attended by over 100 industry professionals.
