MEET US AT SEMICON WEST 2024| BOOTH #6353
We're looking forward to meeting you at the event and discussing our Oxford Instruments solutions with you! Please book an appointment with us using the form below.
Process Solutions for Device Manufacturing and Material Analysis Characterization
This year at Semicon West Oxford Instruments will be showcasing our leading plasma etch and deposition systems and solutions. We will also showcase our materials analysis solutions that enable you to accurately analyze and characterize the etching and deposition materials down to the nanoscale level more rapidly, by combining superior detection and analysis with the AFM, Raman, and EDS technologies.
- GaN power: most accurate feature ALE on the market with EtchpointTM and HVM ALD with interface optimization plasma pre-treatment.
- SiC power: Plasma Polish interface optimisation at several stages of substrate and epi layer processing – low operational cost, subsurface damage removal, low water consumption, and eco-friendly.
- GaAs and InP datacom: HVM device production with smooth, excellent uniformity and highly repeatable processes.
The material characterization tools used to evaluate the performance of the etch and depositions include:
- Atomic Force Microscopy (AFM) enables high-performance materials characterization and critical metrology measurements for academic research, industrial R&D, and QC&FA.
- Confocal Raman imaging microscopes for 2D and 3D chemical characterisation. WITec Raman microscopes can also be integrated with AFM, SEM, SNOM or Raman-based particle analysis as correlative systems for investigating chemical and structural sample properties.
- NanoAnalysis tools enabling materials characterisation (including EDS, BEX,EBSD and WDS) and sample manipulation at the nanometre scale. Used on electron microscopes (SEM and TEM) and ion-beam systems (FIB), our tools are used for R&D and QC&FA across a wide range of semiconductor applications.
