Meet Oxford Instruments at the event for semiconductor manufacturing in Tokyo, Japan (Booth No. 5407 - Hall 5).

The Semicon Japan event is the premier exhibition for the semiconductor manufacturing supply chain for the latest developments, trends and innovations as the industry powers digital transformation. 

Achieve precise and consistent etch, deposition and growth of micro- & nano-structures and films, using atomic layer etch, atomic layer deposition, ICP (etch & dep), PECVD and Plasma Polish Dry Etch for SiC processing with our plasma technology solutions.

Measure crystal homogeneity, material stress and strain in 3D with Raman imaging microscopy; characterise defects, roughness, elasticity and electronic properties using Atomic Force Microscopy (AFM); evaluate structure and elemental composition with the electron microscopy techniques: EDS, EBSD, and the revolutionary BEX (Backscattered Electron and X-Ray)

Our team is looking forward to meeting you at the 5407 (Hall 5) and discussing your current work and process challenges! For further information visit the Semicon Japan 2024 webpage.

If you plan to attend Semicon Japan 2024, be our guest during Customer Technical Update 2024 to discover our processes enabling more goods wafers and better SiC devices at a lower cost. For further information go to the link here.