Oxford Instruments will be exhibiting in Semicon China from the 26th of March 2025.

Meet with us to advance your semiconductor fabrication and characterisation processes with Oxford Instruments’ full spectrum of solutions. Measure crystal homogeneity, material stress and strain in 3D with Raman imaging microscopy; characterise defects, roughness, elasticity and electronic properties using Atomic Force Microscopy (AFM); evaluate structure and elemental composition with the electron microscopy techniques: EDS, EBSD, and the revolutionary BEX (Backscattered Electron and X-Ray); and achieve precise and consistent etch, deposition and growth of micro- & nano-structures and films, using atomic layer etch, atomic layer deposition, ICP (etch & dep), PECVD and Plasma Polish Dry Etch for SiC processing with our plasma technology solutions.

Visit our booth 2189 (Hall N2) at the Shanghai New International Expo Centre to discuss with our team how to meet the increasing semiconductor industry needs with our process solutions. 

Learn more about SEMICON China 2025.