Meet Oxford Instruments at ISTFA 2018

We're looking forward to meeting you at the event and discussing your current work and workflows with you. If you would like to book a meeting with us at the show, please complete the form below.

Oxford Instruments provide industry-leading processes and tools for Failure Analysis (FA) dry etching de-processing, including:

• Polyimide removal (RIE or ICP mode)
• Isotropic Nitride (passivation) removal (PE or ICP mode)
• Anisotropic Oxide (IMD/ILD) removal (RIE or ICP mode)
• Anisotropic Low-K Oxide removal (RIE or ICP mode)
• Metal skeleton removal (RIE or ICP mode)

Our Failure Analysis tools allow a wide range of processes, able to process small die or packaged devices through to 300mm wafers.