Meet Oxford Instruments at CS Mantech 2025
The International Conference on Compound Semiconductor Manufacturing Technology will kick off on Monday, May 19th, and will last until May, 22nd 2025, in New Orleans, Louisiana, USA.
The CS MANTECH conference dedicated to compound semiconductor manufacturing will cover topics such as RF devices, power and optoelectronics, process development and control, materials, manufacturing, test, and device reliability, and finally the role of compound semiconductors in the transition to 6G wireless technology.
Find out more: CS Mantech 2025
Process Solutions for Device Manufacturing
This year at CS Mantech, Oxford Instruments will showcase our leading plasma etch and deposition systems and solutions.
In high-volume manufacturing, our focus is to deliver for our customers more good wafers per day at lower cost. Our systems are utilized by many of the world’s leading semiconductor device manufacturers, reliably producing thousands of high-performance devices daily.
With our expertise as global suppliers of plasma processing equipment, we can help you deliver advanced and reliable solutions to maximize throughput, device performance and yield.
Innovations we will be showcasing include:
GaN power: high-rate GaN HEMT etch with ALE damage removal, and HVM ALD with pre-ALD interface optimization surface treatment,
SiC power: plasma polish interface prep at several substrate and epi stages, with trench etch and ALD
InP datacom: volume production automated 6-inch InP processing solution with high-temp hot ESC processing capability
GaAs VCSEL: volume device production with high uniformity, smooth vertical/slanted profiles, and integrated automated endpointing
Atomic Force Microscopy: characterise defects, roughness, elasticity and electronic properties using AFM.
Oxford Instruments will showcase our volume manufacturing plasma etch and deposition solutions, and our materials analysis solutions, that enable you to accurately remove, deposit, analyse and characterize materials down to the atomic scale, by combining superior plasma processes, detection and analysis solutions.