TEOS PECVD module

PlasmalabSystem133 PECVD system with TEOS delivery module

TEOS PECVD module

Delivery module enabling TEOS-based PECVD for SiO₂ in Plasmalab®System100 and PlasmalabSystem133 process tools

TEOS (tetraethoxysilane, tetraethyl orthosilicate) offers an alternative PECVD precursor to the commonly-used silane (SiH₄) for applications such as photonics and dielectric layers in which high quality, conformal deposition of silicon dioxide (SiO₂) is required. In particular, TEOS-based PECVD enables approximately 85% conformal step coverage, and the ability to control the degree of step coverage by controlling the oxygen radicals within the plasma to vary deposition directionality.

Excellent control in silicon dioxide deposition

The complete TEOS PECVD system enables

High quality, conformal deposition of SiO₂ for photonics, dielectric layers and other structures
Control of film stress by pulsed high/low frequency power mixing for selectable compressive, tensile or low-stress films
Control of deposition directionality and hence degree of step coverage by controlling oxygen radicals

84% conformal step coverage silicon dioxide on Si step structure by TEOS PECVD

Si step coverage with 170 nm silicon dioxide

Si step coverage with 990 nm silicon dioxide

Integrated purpose-designed solution

The TEOS delivery module offers an integrated purpose-designed solution with

Optimised heated delivery lines to ensure efficient, high-uniformity SiO₂ PECVD processes
Easy source access and changeover, with an optional glovebox fitting onto the module for maximum safety, and the ability to connect the module into a cleanroom extraction system
Flexible mounting options - the module may be either directly mounted onto the PlasmalabSystem100 or PlasmalabSystem133 process tool, or wall-mounted
Available as upgrade to existing PlasmalabSystem100 and PlasmalabSystem133 PECVD tools

Detail of TEOS delivery module on PlasmalabSystem133 PECVD system

Easy access to the TEOS precursor source in the heated delivery module

Glovebox fitted to TEOS delivery module on PlasmalabSystem133 PECVD system

Safe TEOS pot change-over using the optional clip-on glovebox.

TEOS PECVD conformal silicon dioxide (SiO2) step coverage

TEOS PECVD showing 84% conformal step coverage (415 nm horizontal, 350 nm sidewall) SiO2 on Si step structure

TEOS PECVD module