Please click here if you would like additional information
OSPrey800 - A revolution in OSP thickness measurement
This instrument measures Organic Solderablity Preservative (OSP) thickness on the individual pads of real-time production boards. The ability to target individual pads allows specific quality control, failure analysis and troubleshooting of the OSP layer. The OSPrey800’s unique non-destructive quality control technique requires neither test coupons nor sample preparation and significantly reduces the time needed to take measurements and operator error.
Other techniques for measuring OSP thickness are either destructive, labor intensive, or expensive. The OSPrey800 utilizes an innovative new technique in which various wavelengths of light are aimed at a sample and the light reflected from the surface of coating and substrate is analyzed to determine coating thickness. Typical thicknesses from 0.035-3µm can be measured and analyzed.
The mechanical shear strength and electrical conductivity of the board rely upon the thickness and integrity of the OSP coating. With the OSPrey800, measurements can be made on the same board when it is newly coated with OSP, in the incoming board quality inspection at facility and after a trip through the reflow oven.
The Windows™ based user interface was designed with intuitive controls for use by production personnel. The user can simultaneously view a CCD image of the surface, a two-dimensional map of the coating thickness and a graphic display of wavelength versus reflectance.
Oxford Instruments’ CMI series XRF systems have been reliably measuring Electroless Nickel Immersion Gold (ENIG), Hot Air Solder Leveling (HASL), Immersion Silver (Im-Ag) and Immersion Tin (Im-Sn) for many years. The OSPrey800 measures OSP thickness, completing the product line for measuring all major PCB surface finishes.
Product finder
Sales & Service Contacts
Downloads and Links
- OSPrey800 brochure
(450Kb)